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Glass Passivated Rectifier Chip

Incorporating several changes in its semiconductor process to cut costs, Rectronix has introduced a glass-passivated rectifier chip (GPRC) technology as a direct competitor to GPR (Sintered Glass Passivation Rectifier). GPRC boasts an increase in current-handling performance and packaging options.

The patented GPRC technology, which eliminates a stress buffer normally needed and entirely glass passivates the chip’s peripheral surfaces, has evolved over 30 years from two major types of passivation. Passivation protects the PN junction from environmental damage and maintains high breakdown voltage.

One type of passivation is the epoxy-over moulded GPR, and the popular GPP, a glass passivated pellet sealed by glass around its open junction. The epoxy-over moulded GPR’s excellent performance is acknowledged, but it is limited to an axial configuration. By contrast, GPP devices are easily assembled into many types of packages and have more applications, but are considered to be limited in performance and reliability.

GPRC’s approach does away with the relatively expensive, so-called “Molyslug” used as a stress buffer in GPR’s to accommodate the differences in thermal expansion between silicon die and metal leads. The new approach provides much higher-current capability than GPR’s glass passivated structure and removes the restrictions on packaging options as well. Moreover, GPRC’s assembly is as easy as GPP’s; yet GPRC has a better assembly yield.

Rectifiers Mounted on Ceramic Chips

Just released,  popular Rectifiers ranges mounted on standard SMD Resistor 1208 & 805 packages. Giving greater ease for pick and place machinery together with the added benefit of lower costings. Ask Office for details.

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